ABOUT THE PROGRAMME
The B.E. program in Electronics Engineering (VLSI Design and Technology), introduced in 2023, is a specialized field within electronics engineering dedicated to chip design, foundry process technology, and chip fabrication.
The program is crucial for developing a profound understanding of semiconductor design, fabrication processes, and system integration (on. It ensures that learners acquire proficiency in advanced tools and methodologies essential for designing intricate integrated circuits, fostering a practical skill set highly sought after by technology-driven industries. Additionally, the program functions as a hub for cu/ng-edge research and promoting innovation.
VISSION
- To strive for excellence in Electronics and Communication Engineering education, research and technological services imparting quality training to students, to make them competent and motivated engineers.
MISSION
- Impart high quality technical education in Electronics and Communication Engineering through effective teaching- learning process and updated curriculum.
- Equip the students with professionalism and technical expertise to provide appropriate solutions to societal and industrial needs.
- Provide stimulating environment for continuously updated facilities to pursue research through creative thinking and team work.
PROGRAMME HIGHLIGHTS
- Advanced Curriculum – Fundamentals of Electronics to Industry driven Electives relevant to chip design and fabrication, State-of-the-art Design Laboratory Courses.
- Industry Offered Internship - Regular internship opportunities for students at Semiconductor MNCs and research organisations- Intel, NXP Semi, Infineon, Incore Semiconductor, CDAC, Bengaluru, Semiconductor Laboratory, Chandigarh.
- Hands-on sessions on Prototype Development through FPGA boards and industry-standard IC design EDA tools (Cadence, Synopsys, Siemens).
- Lectures by Eminent professors from IITs & IIITs, Experts from semiconductor industries, and Scientists from SCL and ISRO.
- Online Certifications through SMART labs at NIELET, Calicut through the C2S programme.
- Opportunity for chip fabrication of academic projects through Centralized Multi-Project Wafer Fabrication mode through the C2S programme.